Packaging Research and Development Engineer


Job title: Packaging Research and Development Engineer

Company: Intel

Job description: team, supports multiple business units’ product assembly needs as well as the SMT manufacturing certification of new CPU… to develop PCB technology roadmap by partnering with Business units and the PCB manufacturing industry. In addition…

Expected salary:

Location: Hillsboro, OR

Job date: Sat, 12 Dec 2020 03:36:15 GMT

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